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| Part Number | Brand | Qty | D/C | Remark | Updated | RFQ |
|---|---|---|---|---|---|---|
| STM32F103C8T6 | ST | 521 | 23+ | In stock | Aug 12, 2026 | RFQ |
| ICM-42688-P | TDK InvenSense | 1,202 | 23+ | In stock | Aug 12, 2026 | RFQ |
| W25Q128JVSIQ | WINBOND | 1,532 | 21+ | In stock | Aug 12, 2026 | RFQ |
| MT41K256M16TW-107:P | Micron | 547 | 21+ | In stock | Aug 12, 2026 | RFQ |
| STM32F407VET6 | ST | 1,744 | 23+ | In stock | Aug 12, 2026 | RFQ |
| TPS5430DDAR | TI | 1,132 | 23+ | In stock | Aug 12, 2026 | RFQ |
| KLM8G1GETF-B041 | SAMSUNG | 1,813 | 23+ | In stock | Aug 12, 2026 | RFQ |
| STM32F103RCT6 | ST | 726 | 23+ | In stock | Aug 12, 2026 | RFQ |
MOSFETs, IGBTs, SiC devices, and GaN devices serve different voltage, frequency, and power ranges. This article explains their applications and the parameters that should guide selection.
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AI servers and data center construction are reshaping demand across the electronic component industry. This article explains how AI demand is spreading to advanced packaging, memory, power management, power semiconductors, and MLCCs, while outlining practical ways to manage lead times, price increases, and supply risks.
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DRAM, NAND, NOR Flash, and HBM serve different roles in electronic systems. This article compares their functions, applications, selection criteria, and supply-chain characteristics.
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